8" - 3M™ 3762LMQ Low-Melt Glue Sticks
Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.

• Excellent "hot-tack" when dispensed at low-melt temperatures.
• Can bond expanded polystyrene, corrugated packaging and displays.
• 25 second bonding range.
• FDA listed.

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